Electromagnetic Compatibility (EMC) is a major day by day problem for all electronic systems, especially for Systems On Board at high frequency. The trend today is a larger integration on PCB for different types of devices, from small to medium power in order to create new electronic products in short time, at lower manufacturing costs. The condition for economical success of a product is to assure, even in the conception stage, a high level of quality by reducing the product cost; to conclude, designing according to production capabilities by using Design For Manufacturing concept. According to DFM concept, a successful project assures EMC design requirements for the system and finally for PCB, accomplices assembling technology constraints according to international standards and directives. The authors, starting from EMC requirements for PCB design, take into account manufacturing constraints and propose modern solutions for SOB and radio-frequency equipment realization.

Keywords: CEM requirement, IPC technological constraint, VPS, SAC, thermoline, Pin-In-Paste.